Synopsys, A*STAR team up to tackle AI chip packaging challenges

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• Center: For years, the semiconductor race was largely about making transistors smaller. That contest is far from over, but the AI boom has shifted part of the battleground elsewhere: how multiple chips are assembled, connected and kept reliable inside a single package. That is the problem Synopsys and Singapore’s Agency for Science, Technology and Research (A*STAR) […] The post Synopsys, A*STAR team up to tackle AI chip packaging challenges appeared first on e27 .
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