Synopsys, A*STAR team up to tackle AI chip packaging challenges

Synopsys, A*STAR team up to tackle AI chip packaging challenges

For years, the semiconductor race was largely about making transistors smaller. That contest is far from over, but the AI boom has shifted part of the battleground elsewhere: how multiple chips are assembled, connected and kept reliable inside a single package. That is the problem Synopsys and Singapore’s Agency for Science, Technology and Research (A*STAR) […] The post Synopsys, A*STAR team up to tackle AI chip packaging challenges appeared first on e27 .